Unification of NQPACK -ND products

Unification of NQPACK -ND products

NQPACK products Normal products

Products ready for remaining resin on the IC mold (products named -ND)

Starting from May 2007, NQPACK144SD was in maintenance mode and only NQPACK144SD-ND was available for sale.

Starting from October 2007, NQPACK100SD was in maintenance mode and only NQPACK100SD-ND was available for sale.

Starting from May 2011, NQPACK064SD was in maintenance mode and only NQPACK064SD-ND was available for sale.

Starting from October 2011, NQPACK176SD was in maintenance mode and only NQPACK176SD-ND was available for sale.

Starting from August 2012, NQPACK080SD was in maintenance mode and only NQPACK080SD-ND was available for sale.

Starting from December 2012, NQPACK120SE was in maintenance mode and only NQPACK120SE-ND was available for sale.

Change made for -ND products

Purpose

To minimize the interference between the remaining resin of an IC and the NQPACK mold to facilitate the mounting of the IC.
Description of change

Description of change

As indicated with◯in the figure on the right, the four corners were expanded all the way to the NQPACK screw area.
This change is made only in the four corners and does not cause any change in the product characteristics.

NQPACK products		Normal products
		Products ready for remaining resin on the IC mold (products named -ND)

Starting from May 2007, NQPACK144SD was in maintenance mode and only NQPACK144SD-ND was available for sale.
Starting from October 2007, NQPACK100SD was in maintenance mode and only NQPACK100SD-ND was available for sale.
Starting from May 2011, NQPACK064SD was in maintenance mode and only NQPACK064SD-ND was available for sale.
Starting from October 2011, NQPACK176SD was in maintenance mode and only NQPACK176SD-ND was available for sale.
Starting from August 2012, NQPACK080SD was in maintenance mode and only NQPACK080SD-ND was available for sale.
Starting from December 2012, NQPACK120SE was in maintenance mode and only NQPACK120SE-ND was available for sale.

Purpose To minimize the interference between the remaining resin of an IC and the NQPACK mold to facilitate the mounting of the IC. Description of change
Description of change As indicated with◯in the figure on the right, the four corners were expanded all the way to the NQPACK screw area. This change is made only in the four corners and does not cause any change in the product characteristics.