CSPACK Features

CSPACK Features

▼ As CSPACK has solder balls on the indentical position with BGA device foot pattern, reflow soldering can be done.
CSPACK solution is lower cost than combination of LSPACK and BSSOCKET.

CSPACK

BGA mounting surface

(pogo pin)

target board surface

(solder ball)

Recommending reflow temperature profile fo CSPACK

Preheating 150 to 180℃, 180 seconds max

Maine heating 210℃ higher, 30 ~60 seconds
( Peak temperature range : 240℃, 10 seconds max )

*CSPACK, in order to prevent oxidation of the solder ball portion, it has been vacuum-packed.

CSPACK
BGA mounting surface (pogo pin)
target board surface (solder ball)

Recommending reflow temperature profile fo CSPACK
Preheating	150 to 180℃, 180 seconds max
Maine heating	210℃ higher, 30 ~60 seconds ( Peak temperature range : 240℃, 10 seconds max )
*CSPACK, in order to prevent oxidation of the solder ball portion, it has been vacuum-packed.

Products > IC Sockets > CSPACK Features

CSPACK Features

▼ As CSPACK has solder balls on the indentical position with BGA device foot pattern, reflow soldering can be done. CSPACK solution is lower cost than combination of LSPACK and BSSOCKET.

Examples

▼ As CSPACK has solder balls on the indentical position with BGA device foot pattern, reflow soldering can be done.
CSPACK solution is lower cost than combination of LSPACK and BSSOCKET.