Products > IC Sockets > CSPACK Features
▼ As CSPACK has solder balls on the indentical position with BGA device foot pattern, reflow soldering can be done.
CSPACK solution is lower cost than combination of LSPACK and BSSOCKET.
BGA mounting surface
target board surface
Recommending reflow temperature profile fo CSPACK
Preheating 150 to 180℃, 180 seconds max Maine heating 210℃ higher, 30 ~60 seconds
( Peak temperature range : 240℃, 10 seconds max )
*CSPACK, in order to prevent oxidation of the solder ball portion, it has been vacuum-packed.