LSPACK Features

LSPACK Features

Screws M2x6mm, 4pcs.(for fixing HQPACK onto NQPACK) LSPACK can load BGA device in combination with BGA size socket.

Using BSSOCKET in combination with CSSOCKET having same size as BGA device, necessary height can gained and even tall components can be placed around BGA pad.

complying with demand of narrow pitch up to 0.4mm.

As a low cost solution, TET's ICPLUG loading BGA device can be also chosen because ICPLUG is directly mated with mated with BSSOCKET without using LSPACK.

LSPACK

BGA mounting surface

(pogo pin)

target board surface

(solder ball)

Optional parts

　 BSSOCKET CSSOCKET CSPLUG CSPLUG/W CSICE

Top

socket pin socket pin BGA pad plug pin QFP plug pin

Undersurface

solder ball plug pin plug pin plug pin BGA pad

Features BGA size socket Mounted on a cable or board, to connect CSPACK, DSPACK, and LSPACK IC socket Mounted on a cable or the substrate and is connected to the CSSOCKET or BSSOCKET IC socket QFP from BGA,Such as the pin conversion BGA the BGA capable adapter

Examples

LSPACK
BGA mounting surface (pogo pin)
target board surface (solder ball)

	BSSOCKET	CSSOCKET	CSPLUG	CSPLUG/W	CSICE
Top
Top	socket pin	socket pin	BGA pad	plug pin	QFP plug pin
Undersurface
Undersurface	solder ball	plug pin	plug pin	plug pin	BGA pad
Features	BGA size socket		Mounted on a cable or board, to connect CSPACK, DSPACK, and LSPACK IC socket	Mounted on a cable or the substrate and is connected to the CSSOCKET or BSSOCKET IC socket	QFP from BGA,Such as the pin conversion BGA the BGA capable adapter